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Product Highlights

Internorm Stil is compatible with the accessory components and profiles in the Interzoll Modul product range.

All profiles for bus or connector technology can be displaced in height by 15 mm.

Use of the earthing set can improve electronic through-plating.

The ventilation process can additionally be optimised by the use of accessories such as air filters and partitions.

The standard enclosure design offers good EMC characteristics, which can be upgraded by the use of optional EMC components.

The side-mounted strap handles or tip-up or carrying handles (available as accessories) make it easy to transport the enclosure.

The enclosure can be fitted with tip-up and stacking feet, depending on the application.

As an option, front handles or 19“ flanges can be fitted to the enclosure instead of covers.

2 heights
3 widths
5 depths
With or without integrated ventilation
Tower enclosure in 2 sizes
Internorm Stil is based on the Interzoll-Modul subrack programme - this also applies to Internorm Stil and the range of Interzoll Modul accessories

Profiles: Al Mg Si 0.5, anodized. Covers: diecast aluminium. Front handles/flanges: diecast aluminium. Side panels, cover and side plates: passivated aluminium.